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Ball Grid Array (BGA) Packaging Market: Expanding Horizons in Semiconductor Innovation
Global Ball Grid Array (BGA) Packaging market size was valued at USD 1.66 billion in 2024 and is projected to reach USD 2.62 billion by 2032, with a CAGR of 5.80% during the forecast period of 2025 to 2032. The Ball Grid Array (BGA) packaging market is gaining significant momentum as demand for high-performance, compact, and reliable electronic components continues to rise across industries....
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